Category

Details

Positioning

Low-cost, high-frequency standard socket for mass production

Test Modes

Manual test, machine test, burn-in test

Key Advantages

Stable contact resistance and long service life; standardized and durable design; supports multiple package types; short design and production lead time

Supported Package Types

Ball array: BGA, LGA, WLCSP (≥ 0.15 mm pitch)Lead: QFP, SO (≥ 0.15 mm pitch)Leadless: QFN (≥ 0.15 mm pitch)

Lead Pitch

> 0.15 mm

Pin Force

15 g – 40 g

Test Travel

0.3 mm – 0.65 mm

Mechanical Pin Life

500K – 1M cycles

Recommended Cleaning Interval

50K – 100K cycles

Contact Resistance

50 mΩ

Rated Current

5 A (continuous)

Bandwidth

> 20 GHz @ −1 dB

Inductance

1.2 nH

Operating Temperature Range

−55 °C to +175 °C

Materials

Socket body: Vespel SP-1, Plavis-N, MDS-100, PEEK ceramic

Spring pin: Gold, PD