Our Technology & Manufacturing Capability
Integrated engineering expertise and scalable manufacturing to support advanced semiconductor testing
At TestPro, we combine advanced engineering capability with high-capacity precision manufacturing to deliver reliable semiconductor test interface solutions.
From concept design and validation to volume production and delivery, our integrated capability ensures consistent performance, quality, and lead time.
Leverage Strategic Partnerships for Advanced Auto Solutions
Cantilever
Pogo solution
Combine strengths for comprehensive automotive solutions
Delivers high-performance test sockets and contact solutions, including QFN, QFP, and custom designs. With strong regional distribution and service capability, To ensure timely delivery and reliable support for semiconductor customers
Provides state-of-the-art test interface products such as high-frequency sockets, RF/5G solutions, temperature-controlled sockets, and tester manipulators. With strong R&D and proven high-speed socket design (up to 56 GHz),enables superior performance and reliability for global customers.
Our collaboration merges innovative distribution with leading hardware, allowing us to offer clients reliable, end-to-end automotive technology solutions worldwide.
Production & Delivery Capability
Production Capacity
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Equipped with 50+ high-precision CNC machining centers, including 5 with micron-level accuracy.
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Supported by 6 digital imaging inspection systems and 15+ microscopes with automated assembly.
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Monthly drilling capacity: 30 million holes.
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Socket output: more than 10K units/month.
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Pin output: 7–8 million pins/month.