Category | Specification |
Application | 5G & RF, High-Frequency, High-Speed Semiconductor Testing |
Socket Structure | Total metal coaxial structure |
Supported Test Modes | Manual Test, Machine Test, Burn-In Test |
Impedance Matching | 50 Ω |
Frequency Performance | Up to 80 GHz |
Data Rate Support | Up to 224 Gbps |
Operating Temperature Range | −55 °C to +175 °C |
Supported Package Types | WLCSP, BGA, LGA, QFN, QFP |
Minimum Pitch | ≥ 0.25 mm |
Contact Resistance | ~80 mΩ |
Rated Current | 3.5 A (continuous) |
Inductance | ~1.0 nH |
Pin Life | 300K – 800K cycles |
Socket Lifetime | > 5 million cycles |
Design Approach | Self-developed, cost-efficient design |
Key Benefits | High signal integrity, stable contact, long service life |
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