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Cleaning units

Cleaning Pad (Recommended)

  • Cleaning pad supports QFP, QFN, and BGA packages

  • Effectively removes debris and oxidation from contact surfaces

  • Improves contact reliability and test stability

  • Suitable for engineering and high-volume production testing

  • Easy replacement and low maintenance

  • Temp range - 50 °C to 180 °C

Cleaning units

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