Wafer Level Burn In

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Wafer Level Burn In

WLBI is a high temperature stress test used in minimizing potential early life failures of dies.

NHK SPRING's WLBI Probe Card solution enables our customers to effectively prescreen the wafer up to 175ºC with a robust vertical interconnect and probe head housing that attach and expand very closely with fine die pads.



Related Link

NHK Web Link:       http://www.nhkspg.co.jp/eng/mc/index.html