Wafer Level Chip Size Package

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Wafer Level Chip Size Package

WLCSP is the technology of packaging and tesing an integrated circuit (IC) at wafer level prior to singulation. This WCSLP is suitable for Cell Phone, PDA, and other mobile/ portable electronics IC applications to minimize package size.

With fine vertical probe technology, NHK SPRING's WLCSP Probe Card is easily capable to test a single IC to multi ICs for further test cot savings.


Related Link

NHK Web Link:      http://www.nhkspg.co.jp/eng/mc/index.html